We would like to know if it's possible to put thermal pads and heat-sink on the top of the following components :AD9375, AD9528, ADP5054.
Our board designed to work under extreme conditions and we would like to reduce the temperature over those chips with heat-sink.
Refer to the below post:
It give answer only to the AD9375 Chip. what about the other two?
AD9528 and ADP5054 use LFCSP package.
The LFCSP is a near chip scale package (CSP), a plastic encapsulated wire bond package with a copper lead frame substrate in a leadless package format. Perimeter input/output pads are located on the outside edges of the package. Electrical contact to the printed circuit board (PCB) is made by soldering the perimeter pads and exposed paddle on the bottom surface of the package to the PCB. Heat is efficiently conducted from the package by soldering the exposed thermal paddle to the PCB.
Please refer to the below application note for further details,