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What solder-ability risks are there from uncontrolled storage and only baking before use, particularly in a high humidity environment?

		
	
				

			

									
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  •  Analog Employees  

			
			
			    	
			                    
                
				                on Nov 9, 2016 
				
			
			
		

		
		                    	    

        	    
Thread Summary

                The user inquires about solderability risks from uncontrolled storage and baking before use in high humidity environments. The final answer highlights that moisture absorption can cause package damage during solder reflow, and lead oxidation can result in unreliable solder joints, which cannot be reversed by baking and may require flux removal, a process unsuitable for volume assembly.
                        	    

                
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What solder-ability risks are there from uncontrolled storage and only baking before use, particularly in a high humidity environment?

			

			
									
		                             
                        

    

                                            
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    •  Analog Employees  
    
            
						
                            
            
            				
            
                on Nov 9, 2016 9:56 PM
            
            
						
			            		
    
		
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    If products are stored outside dry-packs in a high humidity environment, they can absorb moisture between the leads and the package.   If the devices are not completely baked out according to industry standards, that moisture can boil during solder re-flow and pop the package open.   Also, if the packages are left exposed for an extended period, the leads on the package may oxidize, which will result in unreliable solder joints in assembly.   Lead oxidation will not be reversed by bake-out.   Lead oxidization can be removed with flux, but this is a tedious procedure not suitable for volume assembly.  
    
			
    

		
			
	      

		
		
	
    
	
    
		
    
			
		
    
	
    
	
    
		
						
				
						
						
				
				
		
		
    
			
		
    
	
    

    

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