What problems do your micromodule regulators solve?

From the early days the aim was to do our best to address 4 topics: electrical, thermal, layout, functionality. The most difficult is to optimize 2, 3 or all at the same time. And we have. Here is an example of simultaneously optimizing electrical, layout and functionality: a step-down converter from 36V to POL that operates with high efficiency while with very low noise and with one, two or four circuits in one uModule package. We introduced our Silent Switcher uModule regulators. Refer slide numbers 41 to 45 from uModule webcast presentation

Here is another problem that we recently solved after 4 years of research: without sacrificing too much system PCB footprint and copper, how can we produce a very high current uModule regulator that allows fast cooling from all 6 sides specially top and 4 sides, in addition to contact area with PCB.
The solution is allowing heat from MOSFETs to have a path to more metallic mass in contact with outside environment for cooling. Our CoP or component on package assembly have allowed dual 50A or single 100A uModule regulator to fit in only 15x22mm footprint. We are taking advantage of the inductors and using them as heatsinks. Refer slide number 10, and 18 from uModule webcast presentation

From the early days the aim was to do our best to address 4 topics: electrical, thermal, layout, functionality. The most difficult is to optimize 2, 3 or all at the same time. And we have. Here is an example of simultaneously optimizing electrical, layout and functionality: a step-down converter from 36V to POL that operates with high efficiency while with very low noise and with one, two or four circuits in one uModule package. We introduced our Silent Switcher uModule regulators. Refer slide numbers 41 to 45 from uModule webcast presentation

Here is another problem that we recently solved after 4 years of research: without sacrificing too much system PCB footprint and copper, how can we produce a very high current uModule regulator that allows fast cooling from all 6 sides specially top and 4 sides, in addition to contact area with PCB.
The solution is allowing heat from MOSFETs to have a path to more metallic mass in contact with outside environment for cooling. Our CoP or component on package assembly have allowed dual 50A or single 100A uModule regulator to fit in only 15x22mm footprint. We are taking advantage of the inductors and using them as heatsinks. Refer slide number 10, and 18 from uModule webcast presentation