It looks like the ADuCM355 is a co packaged module of ARM Core and AFE, any plans to integrate this into a single IC for a smaller footprint / lower cost?
It looks like the ADuCM355 is a co packaged module of ARM Core and AFE, any plans to integrate this into a single IC for a smaller footprint / lower cost?
On behalf of Daniel Braunworth:
ADI’s advanced packaging capabilities have ensured that we are providing the smallest possible footprint for the integrated functionality at 5mm x 6mm.