Would a ceramic BGA package survive such extreme usage conditions being mounted on a board?

On behalf of Sean D'Arcy:
Most testing of components done by the industry are for the component only as the geometry and physics of mounting on a board are outside of the manufacturers control. Companies can partner together to test prototype designs. For ceramic packages, a lot would depend on the mass and physics of the BGA and the internals (potted, bonding, etc.). Primarily, the trend is to used ceramic to address heat concerns.

On behalf of Sean D'Arcy:
Most testing of components done by the industry are for the component only as the geometry and physics of mounting on a board are outside of the manufacturers control. Companies can partner together to test prototype designs. For ceramic packages, a lot would depend on the mass and physics of the BGA and the internals (potted, bonding, etc.). Primarily, the trend is to used ceramic to address heat concerns.