Would a ceramic BGA package survive such extreme usage conditions being mounted on a board?

Question

When you talk about the survivability of 10000g shocks, does it mean they were tested for this parameter at the level of the component or already mounted on a board? Would a ceramic BGA package survive such extreme usage conditions being mounted on a board?

PKusior · Accepted Answer

On behalf of Sean D'Arcy:
Most testing of components done by the industry are for the component only as the geometry and physics of mounting on a board are outside of the manufacturers control. Companies can partner together to test prototype designs. For ceramic packages, a lot would depend on the mass and physics of the BGA and the internals (potted, bonding, etc.). Primarily, the trend is to used ceramic to address heat concerns.