https://ez.analog.com/webinar/c/e/768<p id="isPasted"><span>Learn about how uModule DC/DC regulators are squeezing more functionality into the same PCB area. With their small size, simplified implementation, scalability, and high-power density, uModule DC/DC regulators provide solutions to power applications in industrial, telecom/datacom, and ATE-instrumentation systems. CoP (Component on Package) technology has increased PCB space-savings with integrated thermal benefits to extend into AI/ML (artificial intelligence and machine learning) applications.</span></p> <p><span><strong>Attendees will Learn:</strong></span></p> <p><span></span></p> <ul> <li> <ul> <li>How increased integration boosts power density</li> <li>Component on Package (CoP) technology benefits for thermal performance</li> <li>Design solutions for AI/ML systems with scalability up to 2000A and PMBus</li> </ul> </li> </ul> <ul></ul>en-USTelligent Community 12