Jason Sekanina Principal Engineer, Technical Marketing

Learn about how uModule DC/DC regulators are squeezing more functionality into the same PCB area. With their small size, simplified implementation, scalability, and high-power density, uModule DC/DC regulators provide solutions to power applications in industrial, telecom/datacom, and ATE-instrumentation systems. CoP (Component on Package) technology has increased PCB space-savings with integrated thermal benefits to extend into AI/ML (artificial intelligence and machine learning) applications.

Attendees will Learn:

    • How increased integration boosts power density
    • Component on Package (CoP) technology benefits for thermal performance
    • Design solutions for AI/ML systems with scalability up to 2000A and PMBus