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For mixed technology signal chains do we need to have any special board considerations?

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  • When considering board design we look a frequency, power, packaging, and thermal considerations of the component more so than the technology. With heat and things like that, that’s where we really have to look at the board design and that comes from higher power components and technologies. But it is mostly those other things that I mentioned that we have to look at other than the technology.

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  • When considering board design we look a frequency, power, packaging, and thermal considerations of the component more so than the technology. With heat and things like that, that’s where we really have to look at the board design and that comes from higher power components and technologies. But it is mostly those other things that I mentioned that we have to look at other than the technology.

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