Shift due to vacuum

Question

I have a product using ADR4533BRZ-R7 (plastic package) as reference to LT3042 LDO. 
 The product will go into a vacuum environment. Any guidance on the offset it may see in vacuum? I image mechanical stress from moisture leaving the package may induce some error. With the ceramic package doing better overall.

BrendanWhelan · Accepted Answer

Mechanical stress doesn't just affect the IC package, it is transmitted to the IC via the PC Board as well. It's important to make sure that the PCB does not change shape (warp, twist, swell/shrink) when moving from assembly to vacuum. This can be accomplished by appropriate board design, standoffs, etc. As far as guidance, it is difficult to predict the effect without knowing anything about the mechanical design. It is best to mitigate where possible.)

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Shift due to vacuum