I have a question about ADV728xA-M.
I already know that ADV7281AM and ADV7282AM are software and pin convertible.
Are die are same between ADV728xAM and ADV7282AM?
If die is the same, is ADI turning off the function of I2P?Are you just pulling out the exam?
How do you separate these two device?
Only test condition is different or some kind of wire bonding option and disable I2P?
Please answer to my question No.2.
Yes, ADV7282A-M,ADV7281A-M are same die only,but features may differ for different chipset in same family.
I already know that ADV7281A don't have I2P.
I am not asking can ADV7281A support I2P or not.
What I'm asking is how ADI is dividing the device even though the DIE is same.
Is it changing with the bonding option,or are ADI sorting by testing?
Please tell me how ADI is separating ADV7281A and ADV7282A in the mass production process.
This I2P is not available in ADV7281A refer below figure, So interlaced to progressive conversion is not possible in this part I2P feature available only in adv7282A, so this feature we can support through i2p registers.Please crosscheck with below block diagram.
I talked about this with ADKK so I will close this thread.