Category: Hardware
Product Number: ADV7513
I am working on an HDI board using micro-vias, and want to interface the ADV7513 output diff pairs to a mini-HDMI connector. I do not have room to route all HDMI diff pairs on outer layers due to mechanical constraints, and have the option of routing two diff pairs (TX0, TX2) on either layer 8 with one adjacent solid ground reference plane, and split power on the other side, or on layer 3, where it will be sandwiched between ground planes. The transceiver and connector are both on the bottom, Layer 12. From a via inductance standpoint I believe L8 is the way to go, but colleagues like the idea of sandwiching the diff pairs between ground planes. Which is preferred?
