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# AD811AN(PDIP Package) Getting Heated for +/-12V Power Supply

Hello Friends,

I am using AD811AN(8 pin PDIP package) video amplifier for my ultrasound receiver signal amplification process.

I have attached reference schematic.

i operate AD811 in dual power supply mode. that is +/-12V.

i have studied datasheet of AD811. in datasheet there is some recommendation for resistor values that can be used for amplification.

i have used those resistors.

at the output, i have put the CRO probe for output signal analysis.

but the problem is  when i switch on both power supply, AD811 is getting heated.

power dissipation will be = (24Vx16mA = 0.384W)

My questions are as below:

1) How can i dissipate heat safely for AD811AN(8 pin PDIP package)? can i use heat sink ?

2) Which are the new CFB Op-Amps which are better then AD811 & can operate on +/-12V & no heat dissipation problem occur(if possible)

3) how can i use VGA for my  ultrasound receiver signal amplification process?is any document is there then give me the link.

attachments.zip
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• Hi Jigar,

Just like what you mention, the power dissipation of the part is approximately 400mW, that's why the part is getting hot. To compute the junction temperature we can use this formula: TJ = TA + (θJA)(PD) without considering the power dissipation of the output. TJ is the junction temperature, TA is the ambient temperature, θJA is the thermal resistance and PD is the power dissipation. Since the thermal resistance of AD811AN is 90°C/ W, we can say that at 400mW the part has a temperature around 61°C at an ambient temperature of 25°C. Does the heating of the part affects its functionality and your expected output?

Kindly refer to this technical article, Data Sheet Intricacies - Absolute Maximum Ratings and Thermal Resistances. Other than using heat sink, there are some tips and recommendations in the article that you can apply to decrease the power dissipation.

Regards,

Jay

• Hi Jigar,

Just like what you mention, the power dissipation of the part is approximately 400mW, that's why the part is getting hot. To compute the junction temperature we can use this formula: TJ = TA + (θJA)(PD) without considering the power dissipation of the output. TJ is the junction temperature, TA is the ambient temperature, θJA is the thermal resistance and PD is the power dissipation. Since the thermal resistance of AD811AN is 90°C/ W, we can say that at 400mW the part has a temperature around 61°C at an ambient temperature of 25°C. Does the heating of the part affects its functionality and your expected output?

Kindly refer to this technical article, Data Sheet Intricacies - Absolute Maximum Ratings and Thermal Resistances. Other than using heat sink, there are some tips and recommendations in the article that you can apply to decrease the power dissipation.