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AD8237 chip scale package or bare die availability?

Question asked by sv_med_design on Sep 29, 2017
Latest reply on Oct 2, 2017 by krisf

The RM-8 MSOP package of the AD8237 is too large for our applicaiton. Is Analog Devices planning to release a CSP similar to the AD8235? If not, can I arrange to purchase the bare dies for the AD8237 and wirebond/glob-top the IC directly to my board? What would be the MOQ to move forward with this approach? Who is the point of contact at AD that could help negotiate this?

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