Board has solder pads for two MOSFET and associated test points. It does not appear to be a removable tape.
What is the approved coating removal method so I can populate these locations?
(nb. Board is Rev 1)
Yes, there is extra metal under the soldermask to provide heat sinking and a lower impedance path for the drains. If your MOSFETs don't fit on the Q1 and Q2 footprints, you could try scratching away the soldermask (areas A and B in the picture here) to get more area if needed, but the boards were designed to accept TO-263 or TO-252 packages.
If you have a board that has the soldermask extend further than these areas, we can definitely get you a replacement.
I'm moving this to the Isolation forum to help better answer your question.
I don't believe the eval boards come with a conformal coating. It could be an oxidation layer from storage. What color is the film? I would guess isopropyl alcohol and a cotton swab would help.
Film is clear and purposely applied . It has absolutely square corners, applied in several strips of varied width.
It extends past the outlines of the pads and over some of the base board and lettering in rectangular patterns
I originally thought it to be a tape,it has a substantial thickness, but it has no "edge" and will not lift with a blade.
It seems more like an applied and cured coating that had a mask used for application.
It is very hard.
It covers pre tinned pads for surface mount mosfet,and I presumed it was for corrosion protection.
It also covers two additional test point/connection locations for the mosfet drain and ground
Insensitive to 91% alcohol, have not tried stronger solvents.
I am suspicious that the board was modified to prevent installation of the mosfets , but the literature was not updated.
Therefore I don't want to damage it , since I will return it if it will not function as advertised.
Disregard , it was an tactile /optical illusion.
A pcb sub layer formed the raised area and visibly showed through.
Retrieving data ...