I want to design a board like AD9467, I have some questions about layer stack up. As you know the easiest way the get good results is to use the design from the EVMs. so I want to use EVMs layer stack up. could you please let me:
dielectric thickness between layer 1 and 2, 7 and 8 and also 4 and 5?
what is the reason of using 4th ground plane? why do you use layer 4 and 5?
I read AD9467 Gerber files topic but did not get the answer to my question.
any help would be greatly appreciated.