what is thermal resistance value (Rjc and Rjb) for ADP1763ACPZ-R7 ?

what is thermal resistance value (Rjc and Rjb) for ADP1763ACPZ-R7 ?

Hi,

Here are the thermal resistance values for ADP1763ACPZ-R7 using a 4-Layer JEDEC Board and 6400mm

^{2}PCB copper area:- Theta-JB: 29.65 °C/W
- Theta-JC: 22.10 °C/W

If you are computing for the junction temperature (T

_{J}), using Psi-JT will give you a more accurate estimation. You can measure the temperature of the package top and use the following equation:T

_{J }= T_{TOP}+ (P_{D}x Psi-JT)where:

T_{J }is the junction temperature

T_{TOP }is the package top temperature

P_{D }is the power dissipation in the die

Psi-JT is the junction to package top thermal characterization parameter (**0.3****°****C/W**for ADP1763ACPZ-R7)

Regards,

ErrgyHi,

You can check

**JEDS51-12**(Guidelines for Reporting and Using Electronic Package Thermal Information) to guide you in reporting JEDEC numbers.https://www.jedec.org/sites/default/files/docs/jesd51-12.pdf

Regards,

Errgy

Hi,

Here are the thermal resistance values for ADP1763ACPZ-R7 using a 4-Layer JEDEC Board and 6400mm

^{2}PCB copper area:If you are computing for the junction temperature (T

_{J}), using Psi-JT will give you a more accurate estimation. You can measure the temperature of the package top and use the following equation:T

_{J }= T_{TOP}+ (P_{D}x Psi-JT)where:

T

_{J }is the junction temperatureT

_{TOP }is the package top temperatureP

_{D }is the power dissipation in the diePsi-JT is the junction to package top thermal characterization parameter (

0.3°C/Wfor ADP1763ACPZ-R7)Regards,

Errgy