what is thermal resistance value (Rjc and Rjb) for ADP1763ACPZ-R7 ?
Here are the thermal resistance values for ADP1763ACPZ-R7 using a 4-Layer JEDEC Board and 6400mm2 PCB copper area:
If you are computing for the junction temperature (TJ), using Psi-JT will give you a more accurate estimation. You can measure the temperature of the package top and use the following equation:
TJ = TTOP + (PD x Psi-JT)
where: TJ is the junction temperature TTOP is the package top temperature PD is the power dissipation in the die Psi-JT is the junction to package top thermal characterization parameter (0.3 °C/W for ADP1763ACPZ-R7)
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Thank you very much Errgy,
if you can share any reference document, that will be very helpful.
You can check JEDS51-12 (Guidelines for Reporting and Using Electronic Package Thermal Information) to guide you in reporting JEDEC numbers.
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