I see in the datasheet for the HMC-ALH382 LNA that the bond pad width and gap are both 100 um (page 4), giving an effective pitch of 200 um. Would I be able to measure this device using 150 um GSG probes?
I don't recommend using 150um probes on 200um pads especially when measuring millimeter wave products. The most accurate and reliable measurements will be with the probes centered on the die bond pads.
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