We are interested in your product, the HMC405 die, but we need the bonding for the contacts of the HBT die for research. Could you please let me know if you could do the bonding for the HBT contacts?
We ship HMC405 die as the die itself without any bonds. Using a packaged gain block can be an alternative if you would like to avoid the bonding process. There are some packaged gain blocks similar to HMC405, like HMC311SC70, HMC788ALP2E, etc. .
Could you tell us the size of the pad for the contact of HMC405 die, as well as the minimum distance between two pads? We would like to know if we could do the bonding ourselves. Thanks.
All the information on the die dimensions is given on the `Outline Drawing` section of the datasheet.
Thank you very much. I found that bond pads are 0.004 inches (0.100 millimeters) square from one of the notes and I was wondering if that is the area of the bond pad. Or could you please tell me whether the bond pad is 100*100 micrometers or 10*10 micrometers?
Thanks and best regards,
Bond pad dimensions are 4 mils by 4 mils. Which is about 0.1 mm by 0.1mm.
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