RF bond pads on the die, what size are they?
In the datasheet, the drawing shows a pitch of 0.1 mm and it also says the RF pads are 0.1 mm x 0.1 mm - am I missing something, but how's that possible?
The RF traces are 0.05 x 0.05mm with 0.1mm pitch
The DC traces are 0.1 x 0.1mm with 0.2mm pitch
Anyone get a chance to look into this? Mark_D I think you might be able to help me out with this?
Basically I want to draw the die in ADS, and the dimensions are very important for me in order to get the connections right... The datasheet isn't clear.
I want to know
1) RF pad sizes
2) RF pad pitches
3) DC pad size
4) DC pad pitches
Thanks, I tried it and it did work.
Unrelated question: The bypass capacitor/resistor, is there a specific brand/model that you recommend or use?
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