My customer is using HMC601LP4E in mass production.
The customer has questions about the soldering conditions of HMC601LP4E.
1. She wants to know the exact reflow conditions for HMC601LP4E.
Could you provide the application note of reflow conditions for HMC601LP4E ?
2. Is there any recommedation for HMC601LP4E solder void % on exposed GND ?
Could you provide a reference point for solder void % on eposed GND ?