I'm going to use HMC-ALH476, HMC442, HMC1081... such as employed wire bonding.
But I can't do that. cause don't have bonding machine...
I tried to find other way.... is it okay to use like flip chip if gold bump diameter and height is 0.001inch.
These chips have 1singal pad and 2 ground pad, so I'd like use CPWG on PCB. Maybe chip's bottom is placed upper side without bonding....
Plase let me know if you have information about this.