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Is it passible Wire bonding chips use like flip chip?

Question asked by yckim on Dec 13, 2016
Latest reply on Dec 13, 2016 by kkaya



I'm going to use HMC-ALH476, HMC442, HMC1081... such as employed wire bonding.

But I can't do that. cause don't have bonding machine...

I tried to find other way.... is it okay to use like flip chip if gold bump diameter and height is 0.001inch.

These chips have 1singal pad  and 2 ground pad, so I'd like use CPWG on PCB. Maybe chip's bottom is placed upper side without bonding....


Plase let me know if you have information about this.

Thank you!