- We are using 5mil thick RO3003 as a substrate to implement the transceiver board.
- As shown in the datasheet the RF connection is a ribbon bond. Owing to assembly problems we are trying to replace the ribbon bond with two wire bonds as done in the power amplifier (HMC1144). If it is doable what should be the suitable wire bond dimensions and how much of our performance does it effect due to the replacement.
- what is the best encapsulant that we can use after assembling the die on to the board so that the RF performance doesn't degrade.