Hi，our customer testing HMC1099 and found that it's package was foaming under hot air gun's 400℃.So what's the hot air gun's temperature very suitable for the HMC1099?Thanks!
As jdobler stated before, there is a great chance that you are damaging the part.
Applying heat from the backside of the PCB would be a better approach when changing the part. If there is heatsink at the back, then heating that with a hot plate will still increase the temperature you need to apply from the hot air gun. For all methods you need to make sure the part is below 260C.
and AN-772 is also good app note to read on this topic in general.
My guess is that you are damaging the package:
Thanks.We have to supply higher temperature more than 260℃ when repalacing chip on pcb board.
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