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HMC495LP3 / 495LP3E Heat Sink Requirements

Question asked by bsbqn5 on Oct 26, 2016
Latest reply on Jan 5, 2017 by stanis

HMC495LP3 / 495LP3E 

The 107309 Eval Board has a very large heat sink on the bottom. My colleagues and I don't see the need for such a large heat sink. Would connecting the exposed paddle to the ground plane using Vias be sufficient? Due to space considerations we would like to place this chip as close as possible to the LO and I/Q signals. The large heat sink would make this difficult.