Datasheet Rev.C says (in Table 8 and 9):
The LFCSP_VQ only has an exposed paddle that must be left unconnected.
What does this imply?
1.) On PCB footprint do not make a corresponding pad, do not solder the exposed paddle to anything.
2.) Have a pad on PCB footprint that the exposed paddle will solder to (for mechanical stability and/or heat dissipation), but do not connect that pad to anything. Parasitic capacitance of this pad to possiblle GND and/or VDD planes does not matter.
Which one is correct?
I recall seeing a message on a similar topic, but could not find it now. My apologies if this has already been discussed...