Would you please help to provide the AD5593R's die temperature individual in ambient-40 and 85°C?
Thank you very much!
No Problem. You are correct, should be -35.52°C.
Would you please kindly help to provide about the AD5593R the IC package body temperature individual in ambience -40 degree and +85 degree condition when chip fully working?
The die temperature will depend on the power dissipated by the device.
Thermal Resistance figures on page 7 on the datasheet will allow you to calculate the increase in temperature from the ambient depending on the power dissipation.
What voltages and currents are you trying to source on your outputs and what package are you using? I can help you calculate the power dissipation.
With outputs unloaded, the increase in temperature is less than 1°C in the TSSOP package.
Can you help to calculate the power dissipation under below condition?
Voltage = 5V
Current = Max in spec
Package = TSSOP
And would you please kindly help to fill below table?
Thank you very much!!
To calculate I need to know more information.
Please see example below, you can base your own calculations on it.
- 8 DACs,
- Internal Reference (2.5V)
- Gain = 2
- VDD = 5V, VLogic = 1.8
- 1k load on each channel
- Each DAC output = 1V
IDD = 1.6mA (Datasheet spec table)
ILogic = 3.5uA (Datasheet spec table)
Power Consumption (Unloaded) = (1.6mA * 5V) + (3.5uA * 1.8V) = 8mW
Driving 1V with a 1k load would give a current of 1mA out on each channel.
The internal amplifiers in the DAC is supplied with 5V. The output of these amplifiers will be 1V. Therefore, 4V must be dropped in the device at 1mA. Power dissipated per channel = 1mA * 4V = 4mW.
On 8 channels, this is 32mW.
Total Power Dissipated = 40mW.
16-lead TSSOP, θJA = 112°C/W.
Increase in temperature = 4.48°C
Tj at ambient -40°C = 35.52°C
Tj at ambient 85°C = 89.48°C
Thank you for your kindly replied.
And I think Tj at ambient -40°C = 35.52°C
Is it should be -35.52°C?
Anyway, I am very appreciate for your kindly help.
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