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Thermal simulations

Question asked by emanbap1000 on May 12, 2016
Latest reply on May 25, 2016 by SMcBride

Hi!

I want to use the HMC461LP3 PA chip and I need to do some thermal simulation so
is it possible to send:

1) thermal properties of the plastic used in the QFN package: Density, Heat
Capacity and Thermal conductivity.

2) The location and areas of the transistors, to know the two areas that are
dissipating power.

Thank you

PA:

http://www.analog.com/media/en/technical-documentation/data-sheets/hmc461.pdf

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