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On CSP-BGA packages, why use SnPbAg ball alloy?

Question asked by BenGumpert on Jul 15, 2011
Latest reply on Aug 2, 2011 by emoulin

Some of the 160- Ball Chip Scale Package Ball Grid Array packages (specifically the one for the AD9739) use a 62%Sn 36%Pb 2%Ag solder alloy for ball composition. Why is this alloy used instead of the typical Sn63Pb37 alloy? Should I expect any differences in soldering or reliability?

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