Pls. explain ADE7880 40-Lead LFCSP_WQ package IC soldering procedure
Thanks & Regards,
For Hand soldering I solder one pad on the PCB and place the ADE7880.Reflow the solder on the pcb to the pin while keeping the ADE7880 aligned correctly and pressing down on the ADE7880 so it is flat on the board while it cools. Now if all the pins are aligned to the pads solder the part down one pin at a time.
Hope this helps you might also try to search youtube soldering qfn or lfcsp
ADE7880 40-Lead LFCSP_WQ package IC is require for baking for 24 hours at 125 degrees Celsius prior to board mount ?
Kindly let me know the requirement of IC baking
If i solder the IC without baking is it create any problem?
Baking the parts to dry them out is the norm for mass production. If you are concerned about bench evaluation of 1 or 2 parts at ambient temp you will be fine as calibration will correct any drift due to soldering. If you plan on testing over temperature after calibrating at ambient and expect datasheet results over the specified temp range you might want to bake the parts out before soldering to reduce package stress after soldering that may cause temperature dependant errors.
Retrieving data ...