Trying to use HMC-AUH312, any recommendation of wire bond wedge size? Or any standard or calculation to determine the bond wedge size vs the bond pad dimension?
We do not have a guideline for wire bond wedge size vs bond pad dimension. For the wire we generally use 1 mil diameter wire.
Could you provide S parameter data file for HMC-AUH312.
See attached file for the spar data.
Please open a new thread next time, so that the traceability would be easier for all.
Thank you the data, and I will start a new thread next time.
Retrieving data ...