Please teach me HMC3653LP3BE and HMC6981LS6.
Please send me channel temperature vs MTTF curve of HMC3653LP3BE and HMC6981LS6.
Please teach me Activation Energy [eV] of HMC3653LP3BE and HMC6981LS6.
I don't have readily available the Arrhenius plots and activation energies for our processes. Even if I could get them, it might not be possible to disclose them without violating NDAs we have with our external foundries. So that I can better answer your questions, I'd like to understand your objective in requesting that information. Are you trying to determine part operating life for conditions at which the Channel Temperature AMRs will be exceeded? The HMC parts are rated for a MTTF of 1M hours at the maximum channel temperature. Does that adequately answer your questions?
Thanks your response.
Yes,we are trying to determine part operating life for conditions at which the Channel Temperature.
I read your comment,so I change the question.
There seems is simulation data.How do you calculate?
The following application note describes the quantities and calculations required to determine the Channel Temperature.
For a typical application of this type of part (on PCB), the dominant path for heat flow is from the die to the ground paddle to the PCB ground plane directly beneath the part. The thermal resistance of that path is very small, while the thermal resistance to the top of the package is very large. For that reason it's important to design your PCB and system so that the ground paddle of the part is kept at a safe temperature. (The temperature of the ground paddle is the Operating Temperature from the data sheet's AMR table). That part of thermal management is heavily influenced by the quantity and type of vias used, heat sinking provided at the backside of the PCB, etc. When we characterize these types of parts in our lab, the EVB is placed on a hot/cold plate so that its heat sink is maintained at a set and controlled temperature. Because the thermal resistance is very low from the ground paddle to the hot/cold plate, the plate temperature is almost identical to the ground paddle temperature (Operating Temperature). With knowledge of the Operating Temperature, the Thermal Resistance of the part (from the data sheet's AMR table), and the power dissipated at our operating conditions, we can calculate the Channel Temperature as follows:
Channel_Temperature = Operating_Temperature + ((Thermal_Resistance) * (Power_Dissipated))
If you are interested, I can post the board files for the EVBs. That would include the Gerber files, manufacturing drawing, etc. If you are designing your own PCB, those files could serve as a good example/reference point.
Thanks your reply About Channel Temperature.
1.I would like to determine the MTTF value.I would like to know actual use conditions (temperature channel) MTTF value.Please tell me a MTTF value (time) of the specific channel temperature.
Please tell me the MTTF in a particular(1 plot) temperature, if you do not have chart.
2.Thanks your reply 'Activation Energy can not be non-disclosure'I find reliability report.
HMC6981Semiconductor Qualification Test Report: PHEMT-K (QTR: 2013-00500)http://www.analog.com/media/en/quality/hmc-qtr/QTR_2013-00500.pdf
HMC3653Semiconductor Qualification Test Report: GaAs HBT-A (QTR: 2013-00228)http://www.analog.com/media/en/quality/hmc-qtr/QTR_2013-00228.pdf
Is it possible to calculate the MTTF value in the value of this document?Please teach me the calculation(The value to be used) if possible calculation method 'Channel temperature - MTTF value'.
For items 1 & 2, are you asking for a plot of MTTF vs. Channel Temperature?
What will be your Operating Temperature? (defined as temperature of the ground paddle)
Thanks your reply.
For items 1 are you asking for a plot of MTTF vs. Channel Temperature?
Yes,it is better.
We would like to review by life.
So,I would to know how to calculate.
You are no response, so I think that the difficult calculation method.
Please teach me the MTTF value at a temperature of below.
The calculation is not difficult.
The HMC6981LS6 QTR contains all of the information necessary to determine MTTF at your alternate temperatures.
I will write up and post an explanation of how to calculate.
Regarding MTTF calculations for the HMC6981LS6 operated at other use temperatures, please see the attached explanation.
The explanation is in the form of a mark-up of QTR2013-00500, which is available on the analog.com website.
I have also created an Excel spreadsheet that calculates new MTTF values as functions of alternate use temperatures.
Let me know if you would like me to email that spreadsheet to you.
Calculations for the HMC3653LP3BE would be performed in the same manner.
Thaks so mach.
Please send spreadsheet to me.
I just found another error ("junction temp") in our QTR and noted the error in an update to my markup.
That update is attached.
Please check your email for the spreadsheet.
Let me know if you have any questions.
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