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HMC451 & HMC633 -die bond pad size

Question asked by sss on Dec 9, 2015
Latest reply on Dec 10, 2015 by sss

Hi all,

 

Please more information for the bond pad size of each die.

 

@datasheets HMC451 & HMC633 die,

it say "TYPICAL BOND IS .004” SQUAR".

 

But it is different the RFIN/RFOUT pads size and the other pads size,

the Outline Drawing @ each datasheets.

 

What is the RFIN/RFOUT pads size, dimension, area @ each devices?

 

Best Regards,

sss

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