I am calculating some lifetimes of electronic circuits using the MIL-STD-756B (one circuit includes the AD8058). AD provides some MTTF for their components (http://www.analog.com/en/about-adi/quality-reliability/reliability-data/wafer-fabrication-data.html) on wafer fabrication level.
Now I am not sure about the MTTF after packing as internal connections might also lead to failures. Do I need to add some terms?
Thanks for your help!