My kind request please help to share the EVAL-HMC451LP3 schamtic and gerber files to design.
Attached are the Gerber files for the PCB used for EVAL-HMC451LP3.
The schematic is shown in the Application Circuit section of the data sheet.
Thanks for the gerbers. Please help to share the PCB material and fabrication details of Eval kit. SO, we can apply same things at our end and see the results.
The PCB material and fabrication details were included in the .dwg file that were enclosed within the .zip file.
PCB material, stack-up and thickness, via types and dimensions, plating requirements, etc., are all described.
Also Please help to share the Gerbers of 111667-HMC451LC3 and Details of PCB material and fabrication.
Please find the attached .zip file containing the Gerber files for evaluation board 111667-HMC451LC3.
The files contained within the .zip show all PCB material and fabrication details.
Attachment is missing.
Gerber files for evaluation board 111667-HMC451LC3.
Sorry! Please see attached.
Still Attachment is missing.
Pls check before sending.
I did check and it was attached, so I don't know why it doesn't appear.
I had the same problem yesterday, so I'll have to check with my EZ admin.
In the meantime, I'll email the file to you. Please check your email associated with your EZ account.
please provide the dielectric thickness used for designing this board. As the Gerber data shows the line width is 16mils and spacing between ground to track is 13 mils.
In the datasheet it has given that the thickness of the dielectric is 10mils(4350B). If I take datasheet Dielectric constant and find out track characteristics impedance, it comes out be 58 Ohm nearer.
So please conform that what is the dielectric constant is used?
I can confirm that the HMC451LC3 evaluation board (111667) was fabricated to the specifications shown in the 111665-1.zip attachment. The fabrication drawing (111665.dwg) was include in that attachment, and it shows all dielectric material and stack-up details, including copper weight and plating thickness. I don't have available the calculations and details that were used during the design of this PCB, so I can't provide to you the dielectric constant that was used. I recommend that you use the dielectric constant for this material as provided by Rogers.
Trace Z calculation results are dependent upon the transmission line model used (CPW vs. GCPW vs micro-strip vs. some type of hybrid coplanar/micro-strip line), how your simulator implements that model, etc. If the details provided on 111665.dwg were not incorporated into your previous calculations of Z, then those calculations probably did not take into account the additional metal thickness provided by the top layer metal plating specified in the notes. Please review the details of 111665.dwg and adjust the inputs to your simulator accordingly.
I know that Hittite had at times used a combination of techniques to verify and adjust PCB design parameters...including the use of EM simulations and laboratory measurements. It's thus possible that the calculations output from a particular simulator still do not result in exactly 50 ohms...though in real life the results for Z are quite favorable.
@Trying again to attach the file...
Retrieving data ...