We are planning to completely over-mold and seal our PCB involving ADAS1000 and ADXL343 parts.
Do you see any concerns with that (specifically effecting the response of the ADAS1000)?
So long as the package integrity of the part is not compromised, then there should be no issue.
I don’t have sufficient info to comment on the potential effect of molding process on our parts packaging.
Is heat dissipation taken into account in this process?
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