What are some of the important layout rules when using a high-speed converter with an epad?
For optimum electrical and thermal performance of the ADC special consideration should be given to the bottom pad while mounting the chip on the board. Since this is the ONLY GND connection, in most modern ICs, it is necessary to make sure that this pad makes very good electrical contact with the board ground. The application note AN-772 explains the best practices involved in designing with ICs that have an epad.
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