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Question asked by ADIguy on May 19, 2015
Latest reply on May 22, 2015 by s.ilke



I'm looking at the thermal specs for the HMC641ALC4 and need some help with clarification of the parameters. On page 3 of the HMC641 data sheet it shows the following:


Thermal Resistance Channel to die bottom

Insertion Loss Path  201 °C/W 

Terminated Path 321 °C/W


My questions are:

1.) Is the Insertion Loss Path  201 °C/W  = to the path straight through the device?

2.) Is the Terminated Path 321 °C/W  = to the path terminated to the internal resistor?

3.) What is meant by the Channel?

4.) How do I calculate the Die to Case temperature?