The thermal resistance Theta_JA of ADP151 in LFCSP package is inconsistent in page 5 (63.6 C/W) and 15 (>91.8 C/W) of the datasheet. Any clarification is appreciated.
Hi Chia-En Yang,
The values on page 5, Table4, were based on a JEDEC-standard setup that uses a 4inch by 3inch PCB. On the other hand, the values shown on page 15, Table6, were simulated using several smaller sized PCBs. The exposed pad of the LFCSP package helps a lot in dissipating heat, especially when it connects to larger area of copper.
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