We are designing a PCB with AD9364. I reviewed reference design files and I turned out that FMCOMMS evaluation boards are populated with 0201 components as decoupling capacitors and they are placed directly underneath AD9364 on the other side just by the ball to be decoupled.
However, we prefer to use 0402 components in order to secure assembly process. In this case, coupling capacitors can not be placed between fan out vias, but around the IC at a longer distance from BGA balls as illustrated in the image below.
Is this acceptable? Or shall they be necessarily placed by the fan out via of the pin to be decoupled?