Our customer will evaluate Amplifier Module, HMC-C004 and HMC-C016.
This is the first time to consider the thermal design of Hittite's connectorized module packages, type C1/C3.
Will you provide recommended method to mount to the pcb for the thermal design ?
What is θja or θjc ?
In the Outline Drawing, it is "Bottom to be held at 85 ℃ max.".
Using at -55 to +85˚C Operating Temperature, we don't have to consider to cool the package ?
Or, we must need the mounting to cool , in order that the package bottom temperature keeps below 85 ℃ ?