We are designing a card using this part and I would like to know what is the recommended land pattern. I used the BXL file to import the symbol & footprint into Altium. I see it has a 1mm pitch and 14mil ball diameter. But when I see the gerbers of the EVAL-7842-7511 evaluation board, I see that the ball diameter is 20mil. We want to avoid soldering issues. What is the best option for us?