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Ground wirebonds for HMC143

Question asked by spavlidis on Nov 5, 2014
Latest reply on May 1, 2015 by wassoshaikh


I have a question regarding wirebonding the Hittite HMC143 mixer chip. In the datasheet, it is recommended that only the signal pad on the chip be wirebonded to a microstrip line on the package, while the backside of the chip is connected to the package's RF ground. I would like to know if it is possible to use a coplanar waveguide (CPW) feed on the package without a conductor backing and then use three wirebonds -- 2 to ground and one to signal -- to connect to the chip. In this case, the backside of the chip would NOT be connected to RF ground.

Is this possible? Are there any effects on performance (e.g., narrowing of bandwidth)?