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position aberration of LP & LC package products after reflow soldering

Question asked by AkiraO on Oct 23, 2014
Latest reply on Oct 30, 2014 by AkiraO

Hello All,

 

We have faced component mounting issue about LP & LC package products (e.g. HMC641LP4E, HMC787LC3B). We can see position aberration after reflow soldering with high rate. We would like to improve failure rate of the component mounting issue. Do you have any idea or advice?

 

Thanks & Regards,

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