AD9665's exposed pad is top of the chip.
Why should it be the top , not the bottom?
And I want to see the image of mounting.
(how to connect the heat sink and board ground)
Yes! The exposed pad is it meant for thermal not for current to pass. The note " The exposed pad should be connected to ground." in the datasheet was an error, instead it is allotted for external heat sink. It allows the part dissipate heat to the heat sink when pulling large amount of current from the device.
As stated in the first page of AD9665 datasheet, the exposed pad should be connected to ground. It seems to be a mistake for the exposed pad on the top of the package is allotted for the external heat sink. If you are pulling high currents from the part, attach an external heat sink to be more efficient. If you're pulling moderate currents you can leave the epad exposed to ambient temperature .
I hope this helps.
Thank you very much for your support.
I would like to make sure.
The exposed pad doesn’t have to connect to ground.
That note “The exposed pad should be connected to ground” means only for thermal ,not for electrical things.
The exposed pad is not main current pass?
Could I have a comment?
Your answer is a clear and helpful.
Thank you very much for your good support!
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