From the data sheet I read:
1. THE EXPOSED PAD IS CONNECTED INTERNALLY TO THE
ADAU1761 GROUNDS. FOR INCREASED RELIABILITY OF THE
SOLDER JOINTS AND MAXIMUM THERMAL CAPABILITY, IT IS
RECOMMENDED THAT THE PAD BE SOLDERED TO THE
I am planning to have a split ground plane. I would typically tie the the DGND
and AGND together at one point (through a low ohm resistor). Is the data sheet
saying that the two AGNDs and the DGND are tied internally to the exposed pad?
It was my intent to have the copper rectangles under the device tied to AGND plane
and then have the DGND connection go to the single connection point. Would this
create a ground loop?