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Temperature stability of ADG1408/1409

Question asked by kqchen on Mar 4, 2014
Latest reply on Mar 5, 2014 by theresaC

Hi I am planning on using the ADG1408/1408 with the 16-Lead Lead Frame Chip Scale Package format for flipchip bonding to a silicon substrate. However, I notice that the maximum operating temperature of the chips are 125 C. My bonding process is at 140-190 C. Would I be able to bond it and then still operate the device (at room temperature) or will that kill the chips?