I want to use the driver amplifier IC ADL5324 for my RF design. The reference layout is given on four layers but I want to design it on a two layer PCB. Are there any changes/caution required designing it on a two layer PCB?
From an RF performance perspective there should be no issue using a two layer board. I would suggest you design for adequate thermal disipation to prevent exceeding the maximum junction temperature of the die. (150 C)
See the solldering information and recommended land pattern section of the datasheet for additional information. Application note AN-772 will also be helpful in designing for adequate thermal dissipation.
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