We need to obtain some additional parametric information which is to be incorporated into our component library. Parts entered into the library are not approved by the component management engineers unless all of the information is populated. To that end, we need the following information:
- Coefficient of thermal expansion(ppm/ °C)
- Junction to ambient thermal impedance(°C/W)
- Junction to board thermal impedance(°C/W)
- Junction to case thermal impedance(°C/W)
- Component marking
We need this information for the following parts:
I know that the ADV7511W datasheet contains some of the thermal information, but this is not mirrored in the documentation for the ADV7611.
If you could advise on this information and / or where to obtain it, that would be greatly appreciated.