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FMCOMMS1 PCB stack-up questions

Question asked by KAAP on Nov 4, 2013
Latest reply on Nov 11, 2013 by KAAP

Have been looking at the PCB stack-up for the FMCOMMS1 board, and found some differencies between the board I have and the Board Files "".

1) Board thickness is listed to 84 mils (2.15mm), but my board only measure 1.6mm (63 mils)

2) All prepregs/cores are listed to 8 mils (203um).

     How are the vias between layers 1-2, 2-3, 8-9 and 9-10 made? Because 203um prepreg seem thick for microvias.

3) Are you using pluged vias? Because a lot of through hole vias are placed in or on the edge of a pad.


Best regards,

Klaus Aalbæk Pedersen