Have been looking at the PCB stack-up for the FMCOMMS1 board, and found some differencies between the board I have and the Board Files "20_011018b.zip".
1) Board thickness is listed to 84 mils (2.15mm), but my board only measure 1.6mm (63 mils)
2) All prepregs/cores are listed to 8 mils (203um).
How are the vias between layers 1-2, 2-3, 8-9 and 9-10 made? Because 203um prepreg seem thick for microvias.
3) Are you using pluged vias? Because a lot of through hole vias are placed in or on the edge of a pad.
Klaus Aalbæk Pedersen